HP joins forces with scientific bodies around the globe
Hewlett-Packard Co. joined forces with a number of scientific bodies around the globe to examine how Linux running on HP’s servers can serve as a key platform for research.
HP is looking for its Itanium processor-based servers to play a big role in the scientific community, and researchers seem to think HP has something to contribute. The group, formally known as the Gelato Federation, is made up of HP, the National Center for Supercomputing Applications, the University of Illinois, the BioInformatics Institute in Singapore, Groupe ESIEE in France, China’s Tsinghua University, Australia’s University of New South Wales and the University of Waterloo in Canada.
Microsoft, Sun urge users to fix Java flaw
Microsoft Corp. and Sun Microsystems Inc. issued warnings that some versions of their Java Virtual Machines (JVMs) contain a flaw that could let a malicious hacker see the information of a user surfing the Internet.
A JVM is a common application installed on many computers that allows programs written in the Java programming language to run. Microsoft has included its version of the JVM in the Windows 98, Windows ME and Windows 2000 operating systems, as well as in its Internet Explorer browser up to Version 5.5. Sun also makes its own version of a JVM that comes with the Netscape browser and that is licensed by other companies such as IBM Corp. and Oracle Corp. Versions 6.1 and lower of Netscape could contain the flaw, according to a Sun security bulletin. In addition, users of Sun’s Solaris operating system that have not installed periodic updates could also be affected.
Chip makers jointly develop 0.09-micron process
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Koninklijke Philips Electronics NV and STMicroelectronics NV have successfully produced chips using a 0.09-micron (90-nanometer) process that is expected to result in faster chips that consume less power, the companies said.
The three companies have successfully produced test 1Mb and 4Mb SRAM (static RAM) chips on 200-mm wafers at the joint ST-Philips pilot production line in Crolles, France, and at TSMC’s Fab 3 research and development facility in Hsinchu, Taiwan, the companies said. Prototype chip production using the 0.09-micron process is expected to begin during the second half of 2002.