Intel details Thunderbolt 4, devices coming later this year

Intel today announced its new Thunderbolt 4 specification for improved peripheral connectivity. While Thunderbolt 4 supports the same 40Gb/s maximum...

July 8th, 2020 Tom Li

Apple A12Z features and subsystems

Apple to fully transition to its own Mac silicon in two years

At its worldwide developer conference on June 22, Apple confirmed the years-old rumour that it will be using its own...

June 23rd, 2020 Tom Li

Intel announces Cooper Lake 3rd gen Xeon processors with improved AI smarts

Intel today announced its 3rd gen “Cooper Lake” Xeon processors with increased AI capabilities. The 3rd gen Intel Xeon processors...

June 18th, 2020 Tom Li

Nokia partners with Broadcom to diversify its chip supplier

Nokia has announced a partnership with Broadcom to develop its Reefshark system-on-chip (SoC) for its AirScale radio access hardware. The...

June 16th, 2020 Tom Li

Intel launches Lakefield 10nm hybrid processor with Foveros 3D packaging

Intel is sharpening its Jenga skills by stacking multiple chips onto a single package. Its new Lakefield hybrid processor announced...

June 15th, 2020 Tom Li

Star chip engineer Jim Keller leaves Intel

Intel announced that Jim Keller, previously vice-president of Intel silicon engineering group, has left the company on June 11, citing...

June 11th, 2020 Tom Li

Intel releases 10th gen vPro processors for businesses

Intel recently released its 10th gen vPro desktop and mobile businesses, bringing a bevy of management and security features along...

May 15th, 2020 Tom Li

AMD introduces Ryzen Pro 4000 series mobile processors

AMD yesterday released its Ryzen Pro 4000 processors for business, adding the AMD Ryzen 7 Pro 4750U, Ryzen 5 Pro...

May 8th, 2020 Tom Li

Understanding Intel Comet Lake-S: what does it really offer?

Intel’s processor performance stagnated in recent years without a strong competitor, but with AMD’s Ryzen processors mounting pressure on Intel’s...

May 4th, 2020 Tom Li